Previous PCB experience preferred. Previous PCB lamination experience highly desired.
Must comply with Company Control Policies and Procedures and all applicable laws including ITAR, EAR and OFAC including but not limited to: a) being able to identify ITAR product on the manufacturing floor and understand that access to these products and related technical data is restricted to only US Citizens and US Permanent Residents; b) recognition of Foreign Person visitors by badge differentiation.
Broad Function: Laminator lays-up I/L cores with pre-preg and copper foil. Utilizing heat and pressure the booked I/L cores are pressed to form a panel. Under close to minimum supervision, depending on assigned job level and skill capability, the Laminator by applying one or more lamination skills will be able to process panels through the lamination operation per the designated Manufacturing Process Procedures. Lamination skills are: flash route, breakdown, lay up, material preparation, and lamination press. Other duties as assigned.
Principal Duties and Responsibilities:
Material Prep: The material prep process is preparing all materials to be used in the lay-up process.
● Monitor humidity in material prep room.
● Verify requirements of incoming materials to package label.
● -(Vendor, correct material, lot number, proper marking, thickness, size)
● Monitor accuracy of materials inventory.
● Monitor usage of material by shelf life.
● Cut Prepreg, caps, copper foil, and tedlar as required.
● Drill lay up holes as necessary.
Lay-up: Lay-up is the process of layering (“booking”) the detail with the prepreg and the copper foil to create a book that will be placed in the lamination press.
● Verify that all necessary materials are available prior to start of job lay-up.
● Lay-up panels per lay-up sheet and traveler.
● Verify bake cycle of details prior to lay-up.
● Clean caul plates with Time Saver.
● Monitor to insure uniform and constant flow of work through area.
● Verify humidity of lay-up room.
● Measure thickness of finished panels.
Breakdown: The breakdown process is the final step after lamination to clean and prepare the panel for the next process.
● De-pin and breakdown books.
● Clean resin from tooling holes, move to flash route for route after lamination.
● Measure panel thickness using micrometer.
● Brush panels for particles.
Process panels per Multilayer Lamination MPP:
● Verify press calibration.
● Verify proper vacuum pressure of press.
● Assure proper placement of books in press.
● Verify temperature and cycle time per traveler.
● Monitor to insure uniform and consistent flow of work through presses.
Perform other duties as assigned.